Marcus Hintermüller, Bernhard Jakoby,
"Using gallium as a protective layer during a solvent bonding process for lab-scale polymer based microfluidic device fabrication"
: Conference Proceedings of the 4th Conference on MicroFluidic Handling Systems, Seite(n) 152-155, 10-2019
Original Titel:
Using gallium as a protective layer during a solvent bonding process for lab-scale polymer based microfluidic device fabrication
Sprache des Titels:
Englisch
Original Buchtitel:
Conference Proceedings of the 4th Conference on MicroFluidic Handling Systems
Original Kurzfassung:
A fabrication process for polymeric microfluidic
devices using a solvent bonding technique is
presented. Liquid gallium is filled into the channels
beforehand, in order to keep their structural integrity
intact during the bonding process. Due to its melting
point just above room temperature, gallium features
several advantages compared to other materials used
in a similar fashion. The proposed method does not
require special equipment and is especially suitable
for rapid prototyping on a small academic lab scale.
Forschungs-