On-wafer Passives De-Embedding Based on Open-pad and Transmission Line measurement
Sprache des Vortragstitels:
Englisch
Original Tagungtitel:
IEEE Bipolar BiCMOS Circuits and Technology Meeting
Sprache des Tagungstitel:
Englisch
Original Kurzfassung:
In this paper, a new de?embedding technique based on open?pad and Transmission Line (TL) measurement is discussed. This technique can be used as an efficient approach to characterize on?chip passives in the millimeter wave range. Using open?pad measurement, parallel parasitics are extracted and removed in the first step. Cross?talk parasitics between two pads that are kept at a constant distance can be assumed constant, and thus both cross?talk and parallel parasitics can be removed. Subsequently, the transfer function matrix of a singleended TL is used to de?embed series parasitics from the measurement results. This calculation leads to a better extraction and removal of the series parasitics compared to using a conventional short dummy pattern. The measurement results are in a close agreement with the simulations up to 110 GHz.
Forschungs-