Model development and verification for spectroscopic ellipsometry analysis of plasma-activated Si wafers for direct wafer bonding
Sprache des Vortragstitels:
Englisch
Original Tagungtitel:
WaferBond'22 - The International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration, Schmalkalden University of Applied Sciences, Germany, 4.-6. Oct. 2022.
Forschungs-