Millimeter-wave radar systems on-chip and in package: Current status and future challenges
Sprache des Vortragstitels:
IEEE Topical Conference on Wireless Sensors and Sensor Networks
Sprache des Tagungstitel:
In this work, we give an overview on recent developments that have been made in the field of mm-wave systems which are integrated on chip or in package. Several aspects like waveforms and signal generation, multi-channel systems for beamforming applications as well as integration of antennas into packages will be discussed. The focus of this work is put on approaches which are suitable for on-chip and in-package integration. The restrictions imposed by the integration into single devices are discussed and several prototype systems are presented.