Examination of different adder structures concerning di/dt in a 180nm technology
Sprache des Vortragstitels:
Englisch
Original Tagungtitel:
10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Sprache des Tagungstitel:
Englisch
Original Kurzfassung:
In the presented paper we examine and compare
different adder structures for their EMC behavior. On the one
hand the analysis is carried out for different topologies as
Ripple Carry Adder and Kogge Stone Adder. And on the other
hand these topologies are realized in different logic styles as
standard CMOS, complementary pass transistor logic, buffered
NMOS pass transistor and complementary buffered NMOS pass
transistor logic. All these variations are compared over di/dt,
power consumption, speed / performance and transistor count.
Additionally a new topology for the Kogge Stone Adder is
introduced.
Forschungs-