Magnetic Field Measurements for Defect Detection in Power Devices
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Campeon Innovation Week
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During their lifetime, power electronic components have to endure several million cycles of thermo-mechanical stress. In this context, the electrical interconnections between the die and the output pins are crucial. Due to the small diameters, redundant wires are necessary in order to guarantee the current-carrying rating of the device. In this particular case, commonly used electrical tests are not able to detect the loss of single wires, which can lead to a shortened life of the device.
Any current-carrying bond wire will create a specific magnetic field. Therefore, missing or not connected bond wires will result in a different magnetic field distribution surrounding the device. Based on the measured magnetic field distribution, missing bond wires can be determined.