Wideband differential antenna in package with superstrate structure at 77GHz
Sprache des Vortragstitels:
Antennas and Propagation (APCAP), 2012 IEEE Asia-Pacific Conference on
Sprache des Tagungstitel:
This paper presents a novel antenna in package solution with superstrate structure at 77 GHz for automotive radar applications. Two edge-coupled patches are driven by a differential signal which supports seamless integration with differential output MMICs in a single package. The antenna has a wide bandwidth (17 GHz) and stable gain. The antenna prototypes are fabricated using Embedded Wafer Level Ball Grid Array (eWLB) packaging technology. The measurement results show that the EIRP of the package (chip + antenna) reaches 11 dBm from 75 GHz to 80 GHz. This concept is suitable for a wide area of millimeter-wave front-end applications.