Andreas Dengg, Christoph Kralovec, Martin Schagerl,
"Multi-method structural health monitoring concept for pinned hybrid joints"
, in Paul Fromme, Zhongqing Su: Health Monitoring of Structural and Biological Systems XVII, Vol. 12488, Seite(n) 135-142, 2023
Original Titel:
Multi-method structural health monitoring concept for pinned hybrid joints
Sprache des Titels:
Englisch
Original Buchtitel:
Health Monitoring of Structural and Biological Systems XVII
Original Kurzfassung:
Large civil aircraft structures underlie strict design requirements such as damage tolerance to ensure safety during flight operation. When it comes to the joining of components of such structures, there is still not much confidence in the process of adhesive bonding. Thus, rivets and bolts are commonly used, despite the advent of more diverse material combinations used and the inherent weight penalty of above-mentioned conventional joining techniques in the aviation
industry. To overcome the issues of classical structural bonding, the adhesive joint between metal and fiber-reinforced polymers (FRP) can be supported by additively manufactured metallic pins which protrude into the composite material,
resulting in so-called pinned hybrid joints. These pins enhance the joint's strength and damage tolerance compared to classical adhesive bonding while being more lightweight than mechanical fastening. However, numerous uncertainties
from scattering material properties to sensible manufacturing processes remain. Structural health monitoring (SHM) of pinned hybrid joints may reduce these uncertainties significantly and guarantee the joint's integrity. The present work proposes a new multi-method SHM concept for pinned hybrid joints that applies piezoelectric wafer active sensors (PWAS) and electric contacting of the structure itself for sensing and a partly shared cable network. Thereby enabling various active and passive methods at low cabling effort. Possible methods and their features concerning sensing capability, self-diagnosis, evaluation reliability, installation location, and additional electrical contacting of the monitored structure are discussed with respect to their combined application potential and challenges.