Timm Ostermann,
"Soft Failure in Integrated Circuits due to ESD Induced EMS Problems"
: 12th International Electrostatic Discharge Workshop IEW, 5-2018
Original Titel:
Soft Failure in Integrated Circuits due to ESD Induced EMS Problems
Sprache des Titels:
Englisch
Original Buchtitel:
12th International Electrostatic Discharge Workshop IEW
Original Kurzfassung:
Soft failures due to ESD events must be taken into account for
the correct function of integrated circuits. In addition to the ESD
characterization of unpowered integrated circuits, especially in
the case of hard failures, an ESD characterization of powered
ICs is necessary in order to analyze possible soft failures. The poster deals with soft failures in integrated circuits due
to interferences in input and output pad cells from the VDD core
and IO supplies. A comparison of the influence of addi -
tional capacitances to buffer the IO/core supply is also included. An important prerequisite for a suitable ESD test pulse
for powered ICs is the repeatability of the measurement. The
measurement system used in this poster and the ESD probe
head, respectively, shows an accurate repeatability of
the measurement. Soft failures occur due to coupling in the
padframe from VDDIO and VDDC to signal pins. Dif-
ferent examples will be given in the poster. The root cause for
those soft failures will be discussed. Scan detector cells are
used to analyze ESD events in the core area of the IC.
The detector cells are connected using a scan chain.
Forschungs-