Thomas Plach, V. Dragoi, Franz Murauer, Kurt Hingerl,
"Plasma Activation for Low Temperature Wafer Bonding"
, in ECS Transactions - Electrochemical Society, Vol. 16, Seite(n) 549-559, 2008, ISSN: 1938-5862
Original Titel:
Plasma Activation for Low Temperature Wafer Bonding