Proc. of the Asia Pacific Microwave Conference (APMC)
We present integrated 160-GHz sensors in a package which combine
SiGe-based mm-wave circuits with an antenna inside single embedded wafer
level ball grid array (eWLB) packages. The eWLB technology provides a
platform to realize miniaturized antennas and to easily combine them
with other building blocks to create a full mm-wave system in package.
With this approach no external mm-wave connections or special low-loss
laminates are required. An imaging system based on the packaged sensors
was realized and measurements were carried out to demonstrate the easy
applicability of the realized components.