Martina Hafner, Andrei Ionut Mardare, Achim Walter Hassel,
"Vapour phase co-deposition of Al-Cu thin film alloys"
, in Physica Status Solidi A: Applications and Materials Science, Vol. 210, Seite(n) 1006-1012, 2013, ISSN: 1862-6319
Original Titel:
Vapour phase co-deposition of Al-Cu thin film alloys
Sprache des Titels:
Englisch
Original Kurzfassung:
The fabrication and characterisation of Al?Cu thin film alloys obtained using co-deposition geometry from individual Al and Cu sources were addressed. A compositional gradient ranging from 36 to 93 at.% Cu was obtained. The surface microstructure evolved with a strong influence on the Cu content. This was connected to the presence of the Cu(111) in the alloys. The electrical resistivity showed a decrease by almost one order of magnitude in the Cu rich region of the Al?Cu combinatorial
library. Al?Cu thin films evaporated from a single source produced a surface compositional gradient of 7 at.%. X-ray photoelectron spectroscopy (XPS) depth profiling revealed an in-depth compositional gradient as well. This behaviour was attributed to the gas phase dynamics of Al and Cu during the thin film formation.
Sprache der Kurzfassung:
Englisch
Journal:
Physica Status Solidi A: Applications and Materials Science