Proc. of the 41st European Microwave Week (EuMC 2011)
Original Kurzfassung:
A novel 77-GHz directional folded dipole antenna
integrated in an embedded wafer level ball grid array (eWLB)
package is presented. For the characterization of the antenna
a frequency multiplier is embedded, which scales the 4.25-GHz
input signal up to 76.5 GHz and allows the use of a commercial
signal source. The antenna structure is manufactured at the
metallic layer, in the fan-out area of the package, and directly
connected to the monolithic integrated frequency multiplier. The
gain of the antenna is about 7 dBi, measured over a large
bandwidth of about 8 GHz. The combination of the frequency
multiplier with the on-package antenna is a promising approach
to future radar modules in a single eWLB package for automotive
radar applications. Such a module avoids 77-GHz transitions to
the PCB and hence simplifies the design and manufacturing of
the radar sensor significantly.
Forschungs-