Proc. of the 13th Electronics Packaging Technology Conference
The embedded wafer level ball grid array (eWLB) is a
novel packaging technology that shows excellent performance
for millimeter-wave (mm-wave) applications. We present simulation
and measurement results of single-ended and differential
transmission lines realized using the thin-film redistribution
layers (RDL) of an eWLB. We demonstrate the capabilities
for the integration of passives on example of a configurable
17/18 GHz down-converter circuit realized in silicongermanium
(SiGe) technology with a fan-in eWLB differential
inductor used for the LC tank. We compare the performance
of differential chip-package-board transitions realized in an
eWLB and in other common package types. We report an optimized
compact chip-package-board transition in the eWLB.
We obtain a simulated insertion loss as low as ?0.65 dB and a
return loss below ?16 dB at 77 GHz without external matching
networks. We introduce the concept of antenna integration
in the eWLB and show examples of single-ended and differential
antenna structures. Finally, we present for the first time a
single-chip four-channel 77 GHz transceiver in SiGe integrated
in the eWLB package together with four dipole antennas.
The presented examples demonstrate that the eWLB
technology is an attractive candidate for mm-wave applications
including system-in-package (SiP).