Title:Integrated mm-Wave Sensors in a PackageAuthor(s):Reinhard Feger,  Abouzar Hamidipour,  Andreas StelzerAbstract:We present integrated 160-GHz sensors in a package which combine SiGe-based mm-wave circuits with an antenna inside single embedded wafer level ball grid array (eWLB) packages. The eWLB technology provides a platform to realize miniaturized antennas and to easily combine them with other building blocks to create a full mm-wave system in package. With this approach no external mm-wave connections or special low-loss laminates are required. An imaging system based on the packaged sensors was realized and measurements were carried out to demonstrate the easy applicability of the realized components.Booktitle:Proc. of the Asia Pacific Microwave Conference (APMC)Page Reference:page 209- 211, 3 page(s)Publishing:11/2013

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